The global molded interconnect device market size was valued at USD 2.09 billion in 2025 and is expected to reach USD 5.84 billion by 2033, at a CAGR of 13.70% during the forecast period
• The market growth is largely fuelled by the increasing demand for miniaturized electronic components in automotive, consumer electronics, and healthcare devices, where MID technology enables integration of electrical and mechanical functions into a single component
Rising adoption of advanced driver assistance systems (ADAS), sensors, and connectivity modules in vehicles is further accelerating the demand for molded interconnect devices
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